EURONANOLAB
EURONANOLAB

15B Av. des Montboucons- Besançon- France

The Site Offer

Tools available @ laboratories

Structural & Morphology Characterization

Dispersed-phases characterisation
ζ-potential ζ-potential
Electron and ion beam technologies
FIB prep for TEM FIB sample preparation for TEM
SEM Scanning Electron Microscopy
SIMS Secondary Ion Mass Spectrometry
TEM Transmission Electron Microscopy
Light and acoustic microscopy
CM Confocal microscopy
OTFM Optical Thin Film Metrology
Scanning probe microscopy
AFM Atomic Force Microscopy
STM Scanning Tunneling Microscopy
Surface/overlayer/interface characterisation
ITCAM Interfacial Tension and Contact angle Measurements
PTRMS PTRMS
X-ray analysis
XRD X-Ray Diffraction
XRR X-Ray Reflectivity

Electronic & Chemical & Magnetic Characterization

Chemical analysis
AT Automated Titration
Electron spectroscopy
IPES Inverse PhotoEmission Spectroscopy
RESPED/RESPES Resonant Photoemission Spectroscopy/Diffraction
UPS Ultra Violet Spectroscopy
XPS X-ray Photoelectron Spectroscopy
Luminescence spectroscopy
CL Cathodoluminescence
FS Fluorescence Spectroscopy
PL PhotoLuminescence
Magnetic characterisation
EPR Electron Paramagnetic Resonance
Magnetometry Magnetometry
MFDC Magnetic/ferroelectric/dielectric char.
MOKE Magneto-Optic Kerr Effect
MT Magneto-transport
Optical spectroscopy
Ellipsometry Ellipsometry
FTIR Fourier Transform Infra Red Spectroscopy and Spectromicroscopy
IRS UHV reflection-absorption IR spectroscopy
OS Optical spectroscopy
Pump-probe Pump-probe
RS Raman spectroscopy

Nano to Micro/Macro

3D shaping
3D MF 3D manufacturing
IM Injection moulding
LSIVP Laser surface and in-volume Patterning
Electrical analysis
EC Electrochemical characterisation
HTEC HT-electrical chracterisation
MET Microprobe electrical testing
MPET Mercury Probe Electrical Testing
RF-VNAC RF VNA characterization with probe station
Mechanical analysis
LCA Life cyle assessment
MP Mechanical properties
Micro-fabrication
CD&P Chip dicing & packaging
DWL Direct write lithography
ECD Electrochemical deposition
I&GLS I & g-line steppers
II Ion implantation
SOTP Silicon oxidation and thermal processes
Standard depos. Standard chemical and physical deposition cleanroom/lab processes
Standard etching Standard dry/wet patterning cleanroom/lab processes
UVL Ultra Violet Lithography
Thermal analysis
DSC Differential Scanning Calorimetry (DSC)
thick films and coatings production
Ink-jet Ink-jet
SS&RP Screen-stencil & roller printer

Growth & Synthesis

Chemical depositions of thin films
ALD Atomic Layer Deposition
CSD Chemical solution deposition
CVD Chemical Vapour Deposition
GBM Graphene-based materials
Physical depositions of thin films
EBE e-beam evaporation
MBE Molecular Beam Epitaxy
MS Magnetron sputtering
PLD Pulsed Laser Deposition
PVDS PVD sputtering
TE Thermal evaporation
Synthesis of nanoparticles
MICS Multiple Ion Cluster Source
Thermal treatments
FLA Flash lamp annealing
SP Sintering processes
TP Thermal processes

Lithography & Patterning

Electron and ion beam lithography
EBL Electron Beam Lithography
FIB Focused Ion Beam
Patterning, replication, and sample navigation
ICP Inductively Coupled Plasma
NIL NanoImprint Lithography
NOT&P Nano-Object Transfer & Positioning
RIE Reactive Ion Etching
Photon-based lithography
SM-DWL Submicron Direct Write Lithography (Binary/Grayscale)
TWL Two-photon Lithography
Scanning probe lithography
AFML Atomic Force Microscopy Lithography
T-SPL Thermal Scanning Probe Lithography
Europe flag
This research project has received funding from the EU's H2020 framework programme for research and innovation under grant agreements NFFA-Europe (n. 654360 from 1/9/2015 to 28/02/2021) and NFFA-Europe-Pilot (n. 101007417 from 1/03/2021 to 28/02/2026)
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