Electrochemical deposition

Nano to Micro/Macro (Micro-fabrication)

Electrochemical deposition or electroplating is generally used for the deposition of metallic films (Au, Ni) with various advantages. The thickness of the coating can be precisely controlled by adjusting the electrochemical parameters. In addition, compared to standard metal deposition techniques, higher deposition rates can be obtained. The electroplating technique is relatively inexpensive as there are no requirements for high vacuum or high temperature systems.  Moreover the resulting coatings are relatively uniform and compact and standard resists can be used as masks during the electroplating process. Last, electroplating is ideal for relatively thick coatings and structures with high aspect ratios.

                                                                                                                                              

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          provided at NFFA-Europe laboratories by:
CNR-IOM (TS)
Italy
C2N-CNRS
France
CSIC-CNM
Spain
INL
Portugal
PSI
Switzerland
INESC-MN
Portugal
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          provided by:
EURONANOLAB
France
CNR-IOM (TS)
Italy
Electrochemical deposition
Electroplating bath
Available material: Asu, Cr, Cu, Ni. Electroless plating: Ag and Au
Small sample preferred but deposition can be accomplished on wafers up to 4"
PSI
Switzerland
Electroplating setups @ Laboratory for Micro and Nanotechnology
Ni and Au electroplating
Two electroplating setups, one for Au and one for Ni electroplating. No further metals are provided for electroplating
Up to a few cm
Current pulses with adjustable duty cycle
Electroplating solution
Electroplating into a lithographically defined mold is possible