Magnetic/ferroelectric/dielectric char.

Electronic & Chemical & Magnetic Characterization (Magnetic characterisation)

Coupled magnetic and electric phenomena open new avenues in ferroelectric memory devices and sensor technologies. The advanced study of these requires different techniques that are mainly based on capacitor-like geometries.

Our custom-made Magneto-electric workstation consists of a superconducting 7 Tesla magnet, a continuous flow cryostat (liquid-N2 or He operation) and custom-designed probes for use with samples in various forms (polycrystalline pellet, single crystal, film and capacitor topology composites) that altogether provide fully computer-controlled programmable measurements.

Advanced sample environments, with temperature and external stimuli sweeping capabilities, explore the induction of electric polarization (magnetization) by an external magnetic (electric) field.

The infrastructure utilizes a user-friendly LabView programmed interface that fulfills the requirements for characterization of the nanomaterials’ in terms of their dielectric permittivity, in an extended frequency range (50 Hz ≤ f ≤ 2 MHz; option with DC-bias ±40 V) and a broad temperature window (2 ≤ T ≤ 320 K). In addition to recording standard isothermal I-V characteristics, more demanding DC electric polarization as well as pyro-electric current experiments can be performed upon temperature sweeps, with the magnetic field (-7≤ H≤ +7 T) as an external stimulus.

A probe station with micromanipulated micrometric tips allow electrical testing (conductivity, frequency-dependent permittivity, ferroelectric polarization loops, etc) of devices in the 70-600 K temperature range under magnetic fields up to 10 kOe. The facility permits testing photoresponse under variable wavelengths in the visible optical range.

provided at NFFA-Europe laboratories by:

CSIC-ICMAB

Spain

FORTH

Greece

provided by:

EURONANOLAB

France

Instruments datasheets

FORTH

Greece

MFDC-FORTH

Manufacturer and model

Applications

Interactive Remote Access

Raw data open file format(s)

Average amount of data produced in 8 hours (M B)

EURONANOLAB

France

MFDC at EURONANOLAB - PoliFAB

provided at NFFA-Europe laboratories by:

CSIC-ICMAB

Spain

FORTH

Greece

provided by:

EURONANOLAB

France

Also consider

Nano to Micro/Macro

UV-SL UV-Soft lithography

Soft Lithography has been successfully used to transfer well-defined micro sized patterns from rigid materials to surfaces of soft materials and biomaterials eg natural or synthetic polymers, allowing the replication of high fidelity microenvironments at low cost and with great repeatability.

Nano to Micro/Macro

Standard depos. Standard chemical and physical deposition cleanroom/lab processes

A set of classical microelectronic processes for deposition, of ancillary materials that are co-adjuvant to the obtention in the micro or nano domain of the functional materials that are the object of the Growth and Synthesis installation. It includes LPCVD and PECVD layers deposition or deposition of metal layers by PVD.

Structural & Morphology Characterization

XRD X-Ray Diffraction

XRD provides non-destructive information on the structural order of a material. At large scattering angles XRD permits to identify different crystal phases and to quantify lattice distances and crystalline volume fractions. At low angles of incidence the surface roughness of a single crystal and the thickness of a deposition layer can be obtained.

Growth & Synthesis

PLD Pulsed Laser Deposition

PLD is widely used to grow thin films of complex oxides and other inorganic and organic materials. It is a simple and versatile technique based in the congruent ablation of a solid material irradiated by an ultraviolet laser.

Nano to Micro/Macro

Standard etching Standard dry/wet patterning cleanroom/lab processes

A set of classical microelectronic processes for pattern transfer through etching of thin films than are co-adjuvant to the functional materials of a given sytem under study in the micro or nano domain. It includes wet and dry etching of all those ancillary dielecric or conducting materials.