Standard chemical and physical deposition cleanroom/lab processes

Nano to Micro/Macro (Micro-fabrication)

In a good number of occasions, the process for obtaining a layer under study conveniently patterned, isolated, ready to be transferred, or to be contacted needs of ancillary materials that, despite not being the object of the scientific interest, are of crucial importance as they not only make possible the preparation and obtention of the main layers, but also can condition some of their basic properties.

This set of techniques contains the required suite of deposition processes for such ancillary materials. Those processes include Low Pressure Chemical Vapor Deposition (LPCVD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) of thin films such as silicon nitride, silicon oxide, polysilicon that can be used as etching masks, implantation and diffusion barriers, dielectric barriers, spacers or conductive layers. Also thin metal layers deposited by evaporation or sputtering are available.                                                                                                      

i
@
          provided at NFFA-Europe laboratories by:
CNR-IOM @TS
Italy
C2N-CNRS
France
CSIC-CNM
Spain
CSIC-ICMAB
Spain
FORTH
Greece
ICN2
Spain
INL
Portugal
LUND + MAX IV
Sweden
PSI
Switzerland
INESC-MN
Portugal
@
          provided by:
EURONANOLAB
France

Instruments datasheets

PSI
Switzerland
Standard deposition @ Laboratory for Micro- and Nanotechnology
Deposition of several metals or semiconductors/oxides by sputtering, e-beam evaporation or thermal evaporation
CNR-IOM @TS
Italy
e-gun evaporator
thin film deposition
metals and oxides (alumina and silica)
5-10 kV
quartz thicknes monitor
CNR-IOM @TS
Italy
sputtering
deposition of thin films of metals and alloys
RF and DC
50-1000 Watt
up tu 4" samples
FORTH
Greece
e-gan evaporator
na
no
na
na
0
EURONANOLAB
France
Standard depos. at EURONANOLAB - IMM
EURONANOLAB
France
Standard depos. at EURONANOLAB - MMI
na
no
no
na
na
0
i
@
          provided at NFFA-Europe laboratories by:
CNR-IOM @TS
Italy
C2N-CNRS
France
CSIC-CNM
Spain
CSIC-ICMAB
Spain
FORTH
Greece
ICN2
Spain
INL
Portugal
LUND + MAX IV
Sweden
PSI
Switzerland
INESC-MN
Portugal
@
          provided by:
EURONANOLAB
France

Also consider

Nano to Micro/Macro

UV-SL UV-Soft lithography

Soft Lithography has been successfully used to transfer well-defined micro sized patterns from rigid materials to surfaces of soft materials and biomaterials eg natural or synthetic polymers, allowing the replication of high fidelity microenvironments at low cost and with great repeatability.

Nano to Micro/Macro

Standard etching Standard dry/wet patterning cleanroom/lab processes

A set of classical microelectronic processes for pattern transfer through etching of thin films than are co-adjuvant to the functional materials of a given sytem under study in the micro or nano domain. It includes wet and dry etching of all those ancillary dielecric or conducting materials.

Lithography & Patterning

RIE Reactive Ion Etching

RIE is used to etch various materials under vacuum in the presence of reactive ions. The sample to be etched is placed in a vacuum chamber and gas is injected into the process chamber via a gas inlet in the top electrode. The lower electrode is negatively biased and a single RF plasma source determines both the ion density and their energy.

Electronic & Chemical & Magnetic Characterization

MFDC Magnetic/ferroelectric/dielectric char.

We provide modular experimental stations to study the evolution of electric and magnetic dipole orders, and their degree of coupling, which is an identifying feature of novel magneto-electric systems. Features for designing multifunctional devices, such as magneto-electric sensors or high-capacity four-state logic memories, can be assessed.

Growth & Synthesis

EBE e-beam evaporation

E-Beam evaporation is a physical vapor deposition (PVD) technique whereby an intense electron beam is generated from a filament and steered via electric and magnetic fields to strike the source material (e.g. pellets of Au) and vaporize it within a vacuum environment.