Standard chemical and physical deposition cleanroom/lab processes

Nano to Micro/Macro (Micro-fabrication)

In a good number of occasions, the process for obtaining a layer under study conveniently patterned, isolated, ready to be transferred, or to be contacted needs of ancillary materials that, despite not being the object of the scientific interest, are of crucial importance as they not only make possible the preparation and obtention of the main layers, but also can condition some of their basic properties.

This set of techniques contains the required suite of deposition processes for such ancillary materials. Those processes include Low Pressure Chemical Vapor Deposition (LPCVD) and Plasma Enhanced Chemical Vapor Deposition (PECVD) of thin films such as silicon nitride, silicon oxide, polysilicon that can be used as etching masks, implantation and diffusion barriers, dielectric barriers, spacers or conductive layers. Also thin metal layers deposited by evaporation or sputtering are available.                                                                                                      

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          provided at NFFA-Europe laboratories by:
CNR-IOM (TS)
Italy
C2N-CNRS
France
CSIC-CNM
Spain
CSIC-ICMAB
Spain
FORTH
Greece
ICN2
Spain
INL
Portugal
LUND + MAX IV
Sweden
PSI
Switzerland
INESC-MN
Portugal
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          provided by:
EURONANOLAB
France
PSI
Switzerland
Standard deposition @ Laboratory for Micro- and Nanotechnology
Deposition of several metals or semiconductors/oxides by sputtering, e-beam evaporation or thermal evaporation
CNR-IOM (TS)
Italy
e-gun evaporator
thin film deposition
metals and oxides (alumina and silica)
5-10 kV
quartz thicknes monitor
CNR-IOM (TS)
Italy
sputtering
deposition of thin films of metals and alloys
RF and DC
50-1000 Watt
up tu 4" samples