e-beam evaporation

Growth & Synthesis (Physical depositions of thin films)

E-Beam evaporation is a physical vapor deposition (PVD) technique whereby an intense electron beam is generated from a filament and steered via electric and magnetic fields to strike the source material (e.g. pellets of Au) and vaporize it within a vacuum environment. At some point as the source material is heated via this energy transfer its surface atoms will have sufficient energy to leave the surface, traverse the vacuum chamber and coat a substrate positioned above the evaporating material.

The advantage of this method over thermal evaporation is the possibility to use higher energies into the material to be evaporated, which leads to the formation of thin films with a higher density and consequently with an increased adhesion to the substrate. This method is also good for posterior lift-off processes, and is the way to obtain thin films with the highest purity. By using a multiple crucible E-beam gun, several different materials can be deposited without breaking the vacuum and thus avoiding interlayer contamination.    

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          provided at NFFA-Europe laboratories by:
C2N-CNRS
France
ICN2
Spain
LUND + MAX IV
Sweden
PSI
Switzerland
EURONANOLAB
France
ICN2
Spain
E-Beam evaporation, AJA International Inc. Model: ATC-8E Orion
Source materials available: gold, platinum, silver, aluminium, titanium, chromium, iron, cobalt, nickel, copper and alumina.
6kW telemark ebeam power supply
substrates up to 4" wafers
2e-7mTorrr base pressure
No
PSI
Switzerland
Univex @ Laboratory for Micro- and Nanotechnology
Thin film deposition by electron beam evaporation. Several metals are available among which: Au, Cr, Ti, Al, Pd, Ni, Pt and others
LUND + MAX IV
Sweden
Temescal E-Beam evaporator
Thin film deposition via E-beam evaporator
Au, Ti, Ni, Al, Cr, Pd, Cu.
Up to 4 2" wafers can be loaded during same run, Maximum wafer size: 6" (150 mm).
Base pressure below 2x10^-7 mbar, maximum throw distance 495 mm
Tilt and rotation of the substrate possible. High accuracy tilting under vacuum possible.
C2N-CNRS
France
Electron beam evaporator Plassys MEB550SL
The MEB 550SL is an electron beam evaporation equipment allowing the deposition of thin metallic layers.
Available Metals: Al, Ag, Au, Ni, Ge, Ti, Cr
Max sample size: 6" (homogeneous over 4 ")
Working pressure: < 2e-7 mbar Limit vacuum: 2,5e-8mbar
Rotary sample holder Angle of incidence: -90° to 90°
quartz microbalances
Quartz balance: 2 Ion cannon: 10cm Gas Line: Ar, O2
EURONANOLAB
France
EBE at EURONANOLAB - IEMN
EURONANOLAB
France
EBE at EURONANOLAB - FEMTO-ST
EURONANOLAB
France
EBE at EURONANOLAB - LAAS
EURONANOLAB
France
EBE at EURONANOLAB - PoliFAB
EURONANOLAB
France
EBE at EURONANOLAB - IMM
EURONANOLAB
France
EBE at EURONANOLAB - Nanotec
EURONANOLAB
France
EBE at EURONANOLAB - MMI
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no
na
no
na
0
EURONANOLAB
France
EBE at EURONANOLAB - IMT
EURONANOLAB
France
EBE at EURONANOLAB - FBK
PSI
Switzerland
BAK UNI
Metal evaporation