Photon-based lithography

UV-IL Ultra Violet - Interference lithography
Laser interference lithography is designed for the fabrication of high quality submicrometer size gratings and arrays over an area of a few cm2. The modulation of the array features is obtained by fine tuning the exposure incidence angle. In this configuration low defect density and high reproducibility are enabled.
SM-DWL Submicron Direct Write Lithography (Binary/Grayscale)
Direct write lithography is a maskless patterning method to produce arbitrary features over large areas. A focused light source is scanned over a surface and exposes a resist according to a CAD design. This technique can be thought as a replacement for a mask aligner with the added capability of spatially modulating the dose (grayscale patterns).
DTL Displacement Talbot Lithography (DTL)
Displacement Talbot Lithography is a contactless method to produce regular features over large areas. A 3D diffraction pattern is formed below a mask with a periodic pattern. A photoresist-coated substrate is moved vertically through this pattern so the effective dose is integrated in space and time forming a collapsed version of the pattern.
TWL Two-photon Lithography
HR 2D and 3D structuring process of a photosensitive material by physical and chemical changes produced in the focusing area of an ultrashort pulse laser of sufficiently high light intensity. 2D resist mask-less patterns, or polymeric micro-parts with a 3D shape can be obtained by scanning the photoresist relative to the beam focus submicron.