The focus will be on two essential themes:

• Theme 1: Novel Materials and Characterization

1. Emerging 2D Materials: Exploring the synthesis and properties of novel two-dimensional materials like graphene, transition metal dichalcogenides (TMDs), and phosphorene for advanced nanoscale applications.
2. Advanced Characterization Techniques: Delving into cutting-edge techniques such as scanning probe microscopy, electron microscopy, and spectroscopy to characterize the structural and electronic properties of nanomaterials with high precision.
3. Quantum Materials: Investigating the unique quantum mechanical properties of materials, including topological insulators and quantum dots, and their potential for next-generation electronics and quantum computing.
4. Metamaterials and Plasmonics: Researching metamaterials with engineered electromagnetic properties and plasmonic materials for manipulating light at the nanoscale, opening up possibilities for ultra-compact photonic devices.
5. Nanomaterials for Energy: Studying the development of nanomaterials for energy harvesting, thermoelectric materials, and energy storage devices to address energy harvesting and storage challenges.

• Theme 2: Fabrication Processes of Micro- and Nano-Systems and their Integration into Devices

1. Microfabrication Techniques: Exploring microfabrication methods such as photolithography, etching, and thin-film deposition for creating miniaturized electronic and MEMS (Micro-Electro-Mechanical Systems) components.

2. Nanomanufacturing: Investigating advanced nanomanufacturing processes like nanoimprint lithography, directed self-assembly, and molecular assembly for precise nanostructure fabrication.

3. MEMS and NEMS Devices: Researching the design, fabrication, and integration of Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) devices for various applications, from sensors to actuators.

4. Photonics Integration: Exploring fabrication processes and techniques for integrating photonic components into micro- and nano-systems, enabling advancements in optical communication, sensors, and signal processing.

5. Advanced Packaging and Interconnects: Exploring innovations in packaging technologies and interconnect solutions for enhancing the performance and reliability of micro- and nano-systems, especially in electronics and photonics applications.

More information can be found at this link.