Electrochemical deposition

Lithography & Patterning Installation 1
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Electrochemical deposition or electroplating is generally used for the deposition of metallic films (Au, Ni) with various advantages. The thickness of the coating can be precisely controlled by adjusting the electrochemical parameters. In addition, compared to standard metal deposition techniques, higher deposition rates can be obtained. The electroplating technique is relatively inexpensive as there are no requirements for high vacuum or high temperature systems.  Moreover the resulting coatings are relatively uniform and compact and standard resists can be used as masks during the electroplating process. Last, electroplating is ideal for relatively thick coatings and structures with high aspect ratios.


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Electroplating setups @ Laboratory for Micro and Nanotechnology

Ni and Au electroplating

Two electroplating setups, one for Au and one for Ni electroplating. No further metals are provided for electroplating

Current pulses with adjustable duty cycle

Up to a few cm

Electroplating solution

Electroplating into a lithographically defined mold is possible


Electrochemical deposition

Electroplating bath

Available material: Asu, Cr, Cu, Ni. Electroless plating: Ag and Au

Small sample preferred but deposition can be accomplished on wafers up to 4"


Electroplating Set-up

Electroplating of metals: Cu, Ni, Au, SnAg, NiCo

Autolab PGSTAT 302N Potentiostat/Galvanostat

Max current= 2A

Voltage range: ±10V

Metal thickness from 100 nm to some microns

Manual holders

Vertical position

From chips up to 4” wafers

AUTOLAB control

Electrochemical fields

Chemical solution immersion

Impedance and corrosion analysis allowed

Electroless baths available for chemical deposition

Chemical benches for seed layers and resist etching

Optical microscope